The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2017

Filed:

May. 08, 2008
Applicants:

Dominique Luneau, Chilly, FR;

Paul Varillon, Grenoble, FR;

Inventors:

Dominique Luneau, Chilly, FR;

Paul Varillon, Grenoble, FR;

Assignee:

STMicroelectronics S.A., Montrouge, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61B 1/005 (2006.01); H04N 7/18 (2006.01); A61B 1/05 (2006.01); G02B 23/24 (2006.01); H04N 5/225 (2006.01); A61B 1/00 (2006.01); A61B 1/04 (2006.01); A61B 1/06 (2006.01);
U.S. Cl.
CPC ...
A61B 1/05 (2013.01); A61B 1/0008 (2013.01); A61B 1/0051 (2013.01); A61B 1/00114 (2013.01); A61B 1/00181 (2013.01); G02B 23/2423 (2013.01); H04N 5/2251 (2013.01); A61B 1/0011 (2013.01); A61B 1/041 (2013.01); A61B 1/06 (2013.01); H04N 2005/2255 (2013.01);
Abstract

A head of a cavity exploration device, with an integrated circuit support which has first and second surfaces and a plurality of through-holes associated with corresponding first and second conducting pads positioned on the respective first and second surfaces of the integrated circuit support, a respective conducting micro-cable is placed in the through-hole, with this micro-cable having a portion which is uninsulated for a length greater than or equal to the thickness of the support. The micro-cable is soldered to the associated first and second conducting pads. Next the micro-cable is glued to the first and second associated conducting pads. The micro-cable is molded in first and second resin layers onto the respective first and second conducting pads, with the resin layers covering the uninsulated portion of the micro-cable.


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