The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Jan. 21, 2013
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Fusanori Nishikimi, Hitachinaka, JP;

Kenji Ohshima, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02M 7/00 (2006.01); B60L 3/00 (2006.01); B60L 11/00 (2006.01); B60L 11/14 (2006.01); B60L 15/00 (2006.01); B60L 15/20 (2006.01); H02M 7/797 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20127 (2013.01); B60L 3/003 (2013.01); B60L 3/0061 (2013.01); B60L 11/005 (2013.01); B60L 11/14 (2013.01); B60L 15/007 (2013.01); B60L 15/20 (2013.01); H02M 7/003 (2013.01); H02M 7/797 (2013.01); B60L 2210/40 (2013.01); B60L 2220/14 (2013.01); B60L 2240/36 (2013.01); B60L 2240/423 (2013.01); B60L 2240/525 (2013.01); Y02T 10/645 (2013.01); Y02T 10/70 (2013.01); Y02T 10/7022 (2013.01); Y02T 10/7077 (2013.01); Y02T 10/7241 (2013.01); Y02T 10/7275 (2013.01);
Abstract

In a power converter, cooling of the power converter is extremely important for improving a power conversion performance. Specifically, a DC smoothing capacitor module stored in a housing of the power converter is heat-sensitive, and in order to secure the performance, efficient cooling of the capacitor module is required. In addition, reducing the heat entering from the outside as much as possible is required. A conductor panel of the capacitor module and the housing are connected via a cooling panel, an AC connection bus bar and the housing is connected by the cooling panel to release heat from the capacitor module and the AC connection bus bar to the housing via the cooling panel.


Find Patent Forward Citations

Loading…