The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
May. 29, 2015
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventor:
Aki Dote, Isehara, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H05K 3/28 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/282 (2013.01); H01L 2224/16145 (2013.01); H05K 1/111 (2013.01); H05K 3/3436 (2013.01); H05K 3/4007 (2013.01); H05K 2201/09272 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/10515 (2013.01); H05K 2203/0597 (2013.01); Y10T 29/49163 (2015.01);
Abstract
An electronic component includes: a substrate; wiring provided on the substrate, and including an uneven section at an edge portion of the wiring in plain view; and an insulating film provided on the substrate and on the wiring. And a method of manufacturing an electronic component includes: forming, on a substrate, wiring including an uneven section at an edge portion of the wiring in plain view; and forming an insulating film on the substrate and on the wiring.