The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Feb. 02, 2012
Applicants:
Seung Hun Hong, Seoul, KR;
Min Baek Lee, Gyeonggi-do, KR;
Inventors:
Seung Hun Hong, Seoul, KR;
Min Baek Lee, Gyeonggi-do, KR;
Assignee:
SNU R&DB FOUNDATION, Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 1/16 (2006.01); B82Y 10/00 (2011.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/167 (2013.01); B82Y 10/00 (2013.01); H01L 2924/0002 (2013.01); H05K 3/12 (2013.01); H05K 2201/026 (2013.01); H05K 2203/1173 (2013.01); Y10S 977/734 (2013.01); Y10S 977/883 (2013.01); Y10S 977/902 (2013.01); Y10S 977/932 (2013.01);
Abstract
Example methods of fabricating a circuit board are disclosed. An example method includes providing a substrate, forming at least one or more channels having linear nanostructures on the substrate, and forming a first electrode and a second electrode on the substrate, where the at least one or more channels electrically couple the first electrode to the second electrode.
Hong, Seung. (2017). Method of fabricating a circuit board (U.S. Patent No. 9596762). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9596762
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile