The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Jun. 21, 2013
Applicant:

E. I. Du Pont DE Nemours and Company, Wilmington, DE (US);

Inventors:

G. Sidney Cox, Durham, NC (US);

Christopher Dennis Simone, Pickerington, OH (US);

Carl Robert Haeger, Reynoldsburg, OH (US);

Assignee:

E I DU PONT DE NEMOURS AND COMPANY, Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); H05K 1/05 (2006.01); H01B 3/30 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/28 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/28 (2006.01); C08G 73/10 (2006.01); H05K 1/09 (2006.01); B32B 27/20 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/056 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/20 (2013.01); B32B 27/281 (2013.01); C08G 73/105 (2013.01); C08G 73/1039 (2013.01); C08G 73/1042 (2013.01); C08G 73/1067 (2013.01); C08G 73/1071 (2013.01); H01B 3/306 (2013.01); H05K 1/0271 (2013.01); H05K 1/0298 (2013.01); H05K 1/036 (2013.01); H05K 1/0346 (2013.01); H05K 1/0373 (2013.01); H05K 1/09 (2013.01); H05K 3/281 (2013.01); B32B 2307/204 (2013.01); B32B 2307/206 (2013.01); B32B 2307/302 (2013.01); B32B 2307/4026 (2013.01); B32B 2457/00 (2013.01); B32B 2457/08 (2013.01); H05K 3/022 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0323 (2013.01); Y10T 428/24851 (2015.01); Y10T 428/263 (2015.01); Y10T 428/264 (2015.01); Y10T 428/266 (2015.01); Y10T 428/31681 (2015.04);
Abstract

The present disclosure is directed to a circuit board having a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply derived from 100 mole % 3,3',4,4′-biphenyl tetracarboxylic dianhydride, 20 to 90 mole % 2,2′-bis(trifluoromethyl)benzidine, and 10 to 80 mole % 4,4′-oxydianiline, a third imaged metal layer, a second electrically insulating layer and a forth imaged metal layer. The circuit board does not have an adhesive layer between the second imaged metal layer and the polyimide bondply or the third imaged layer and the polyimide bondply.


Find Patent Forward Citations

Loading…