The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Sep. 06, 2013
Apple Inc., Cupertino, CA (US);
Amanda R. Rainer, Santa Clara, CA (US);
Connor R. Duke, Sunnyvale, CA (US);
James W. Bilanski, Palo Alto, CA (US);
Jeffrey M. Thoma, Mountain View, CA (US);
Michael Eng, San Jose, CA (US);
Mingzhe Li, Tianjin, CN;
Sung Woo Yoo, Santa Clara, CA (US);
Miguel Alejandro Lara-Pena, Gilroy, CA (US);
Weng Choy Foo, Shanghai, CN;
Kieran Poulain, San Francisco, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill.