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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9596754 B1

PDFFull Text
Date of Patent:
Mar. 14, 2017

Filed:

Dec. 18, 2012

Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate

Applicant:

Taiyo Ink Mfg. Co., Ltd., Hiki-gun, JP;

Inventors:

Gento Iwayama;

Arata Endo, Hiki-gun, JP;

Shoji Minegishi, Hiki-gun, JP;

Masao Arima, Hiki-gun, JP;

Assignee:

TAIYO INK MFG. CO., LTD., Hiki-gun, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Timothy Thompson

Assistant Examiner:

Rhadames J Alonzo Miller

Int. Cl.
CPC ...
H05K 1/00 (2006.01); B32B 7/02 (2006.01); B32B 27/38 (2006.01); G06F 7/00 (2006.01); H01L 21/00 (2006.01); H05K 1/03 (2006.01); H01L 21/56 (2006.01); H05K 3/28 (2006.01); H01L 23/498 (2006.01); G03F 7/40 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); B32B 27/08 (2006.01); B32B 27/16 (2006.01); B32B 27/20 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0353 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/20 (2013.01); G03F 7/40 (2013.01); H01L 21/563 (2013.01); H01L 23/49816 (2013.01); H01L 23/49894 (2013.01); H05K 1/036 (2013.01); H05K 1/0373 (2013.01); H05K 3/0082 (2013.01); H05K 3/281 (2013.01); H05K 3/4611 (2013.01); B32B 2264/102 (2013.01); B32B 2264/104 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2457/08 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H05K 3/3436 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10977 (2013.01); Y10T 428/24975 (2015.01); Y10T 428/31515 (2015.04);
Abstract

A dry film includes a carrier film, a thermosetting resin composition layer, and a photocurable resin composition layer formed between the carrier film and the thermosetting resin composition layer. The thermosetting resin composition layer is formed by applying and drying a thermosetting resin composition. The photocurable resin composition layer is formed by applying and drying a photocurable resin composition. A method of producing a printed writing board includes forming a resin insulation layer which includes a thermosetting resin composition layer and a photocurable resin composition layer on the substrate, in the order of the thermosetting resin composition layer and the photocurable resin composition layer from a surface side of the substrate, patterning the resin insulation layer by photolithographic approach, and patterning the resin insulation layer by laser processing.

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