The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Mar. 30, 2015
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Hiroshi Yamada, Kyoto, JP;

Takuji Okamura, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto-shi, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H01L 23/053 (2006.01); H01L 23/13 (2006.01); H01L 23/15 (2006.01); H01L 23/36 (2006.01); H05K 1/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H01L 23/053 (2013.01); H01L 23/13 (2013.01); H01L 23/15 (2013.01); H01L 23/36 (2013.01); H05K 1/0313 (2013.01); H05K 1/182 (2013.01); H01L 23/562 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/3511 (2013.01); H05K 2201/09009 (2013.01);
Abstract

There is provided a substrate for mounting electronic elements, including: a frame-shaped first wiring substrate with a first through hole formed in an interior portion thereof; a flat plate-shaped or frame-shaped second wiring substrate arranged to overlap with a bottom surface of the first wiring substrate and electrically connected thereto; and a sheet-shaped metal sheet arranged to overlap with a bottom surface of the second wiring substrate such that the second wiring substrate is sandwiched between the first wiring substrate and the metal sheet, an area inside the frame-shaped first wiring substrate or areas inside the frame-shaped first wiring substrate and second wiring substrate being electronic element mounting areas, and the second wiring substrate having an elastic modulus lower than those of the first wiring substrate and the metal sheet.


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