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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9595768 B1

PDFFull Text
Date of Patent:
Mar. 14, 2017

Filed:

May. 02, 2012

Glazing with a soldered connector

Applicants:

Michael Lyon, Bickerstaffe, GB;

Naotaka Ikawa, Osaka, JP;

Kazuo Inada, Osaka, JP;

Mamoru Yoshida, Tokyo, JP;

Takashi Muromachi, Tokyo, JP;

Kazuhisa Ono, Tokyo, JP;

Kozo Okamoto, Osaka, JP;

Takashi Suzuki, Osaka, JP;

Inventors:

Michael Lyon, Bickerstaffe, GB;

Naotaka Ikawa, Osaka, JP;

Kazuo Inada, Osaka, JP;

Mamoru Yoshida, Tokyo, JP;

Takashi Muromachi, Tokyo, JP;

Kazuhisa Ono, Tokyo, JP;

Kozo Okamoto, Osaka, JP;

Takashi Suzuki, Osaka, JP;

Assignees:

Pilkington Group Limited, Lathom, GB;

Nippon Sheet Glass Co. Ltd., Tokyo, JP;

Nishinihon Shoko Co., Ltd., Osaka, JP;

Attorney:

Marshall & Melhorn, LLC

Primary Examiner:

Kiley Stoner

Int. Cl.
CPC ...
B23K 31/02 (2006.01); H01R 4/02 (2006.01); B23K 35/26 (2006.01); B32B 17/10 (2006.01); C03C 27/04 (2006.01); B23K 35/00 (2006.01); B32B 15/01 (2006.01); C22C 13/00 (2006.01); C22C 28/00 (2006.01);
U.S. Cl.
CPC ...
H01R 4/023 (2013.01); B23K 35/001 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B32B 15/01 (2013.01); B32B 17/10174 (2013.01); C03C 27/046 (2013.01); C22C 13/00 (2013.01); C22C 28/00 (2013.01);
Abstract

A glazing is disclosed comprising at least one ply of glass having an electrically conductive component on at least one surface, and an electrical connector electrically connected to the electrically conductive component through a soldered joint, the solder of the joint having a composition comprising 0.5 wt % or more indium, wherein the electrical connector comprises a nickel plated contact for contacting the solder. Also disclosed are solders having a composition comprising 14 to 75 wt % In, 14 to 75 wt % Sn, to 5 wt % Ag, to 5 wt % Ni, and less than 0.1 wt % Pb. Also disclosed is use of a solder having a composition comprising 0.5 wt % or more indium to solder a nickel plated electrical connector to an electrically conductive component on the surface of a ply of glass. The aspects of the invention improve the durability of electrical connections on glazing.

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