The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Dec. 26, 2014
Applicant:

Wistron Neweb Corp., Hsinchu, TW;

Inventors:

Babak Radi, Hsinchu, TW;

Yong-Jyun Lu, Hsinchu, TW;

Ming-Chi Chiu, Hsinchu, TW;

Chien-Min Hsu, Hsinchu, TW;

Shih-Hong Chen, Hsinchu, TW;

Assignee:

Wistron NeWeb Corp., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H05K 3/04 (2006.01); H05K 3/14 (2006.01); H05K 3/16 (2006.01); H05K 1/03 (2006.01); H05K 3/38 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H05K 3/048 (2013.01); H05K 3/146 (2013.01); H05K 3/16 (2013.01); H01Q 1/22 (2013.01); H05K 1/0326 (2013.01); H05K 1/0346 (2013.01); H05K 1/0353 (2013.01); H05K 3/381 (2013.01); H05K 2201/0129 (2013.01); H05K 2203/0769 (2013.01); H05K 2203/0783 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1184 (2013.01); H05K 2203/308 (2013.01);
Abstract

A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided.


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