The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Dec. 09, 2014
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Inventors:
Akihiko Happoya, Ome, JP;
Daigo Suzuki, Kawasaki, JP;
Assignee:
KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/38 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 33/385 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/505 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 2224/13599 (2013.01);
Abstract
According to one embodiment, an electronic component includes a metal portion, a mold resin covering at least a part of the metal portion, and a molecular adhesion layer provided between a surface of the metal portion and the mold resin.