The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Jan. 02, 2013
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Seok Hun Bae, Seoul, KR;

Seok Beom Choi, Seoul, KR;

Pil Geun Kang, Seoul, KR;

Deok Ki Hwang, Seoul, KR;

Young Ju Han, Seoul, KR;

Hee Seok Choi, Seoul, KR;

Young Rok Park, Seoul, KR;

Tae Don Lee, Seoul, KR;

Hyun Sung Oh, Seoul, KR;

Jee Hue Joo, Seoul, KR;

Dong Woo Kang, Seoul, KR;

Sung Sig Kim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/40 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/20 (2010.01); H01L 33/38 (2010.01); H01L 33/44 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/405 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/20 (2013.01); H01L 33/382 (2013.01); H01L 33/44 (2013.01); H01L 33/641 (2013.01); H01L 2224/14 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16245 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/1301 (2013.01);
Abstract

Disclosed are a light emitting device, a light emitting device package and a light emitting module. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a support member under the light emitting structure; a reflective electrode layer between the second conductive semiconductor layer and the support member; and first to third connection electrodes spaced apart from each other in the support member. The second connection electrode is disposed between the first and third connection electrodes, the first and third connection electrodes are electrically connected with each other, and the support member is disposed at a peripheral portion of the first to third connection electrodes.


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