The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Sep. 09, 2015
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, KR;
Inventors:
Yosuke Miyazawa, Okaya, JP;
Kazunaga Onishi, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); B23K 20/10 (2006.01); B23K 37/04 (2006.01); H01L 23/492 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49844 (2013.01); B23K 20/10 (2013.01); B23K 37/0408 (2013.01); H01L 23/492 (2013.01); B23K 2201/40 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/3511 (2013.01); H05K 3/3421 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/167 (2013.01);
Abstract
An apparatus for a manufacturing semiconductor device including a plate member and a joint member. The apparatus includes a plate-type tool having the plate member mounted thereon, a first fixing tool and a second fixing tool having an inclined surface for abutting an upper edge of an end part in a width direction of plate member. The second fixing tool is fixed onto the plate-type tool adjacent to the end part. An ultrasonic horn applies ultrasonic vibration in the width direction of plate member while pressing the joint member toward the plate member.