The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Nov. 24, 2015
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Inventors:
Takuya Ohtsuki, Yokkaichi, JP;
Takashi Ohashi, Yokkaichi, JP;
Assignee:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/027 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76892 (2013.01); H01L 21/7682 (2013.01); H01L 23/528 (2013.01); H01L 23/5329 (2013.01); H01L 23/53204 (2013.01);
Abstract
According to one embodiment, a manufacturing method of a semiconductor device comprises forming a first pattern and a second pattern to be placed apart on a semiconductor substrate; and forming an arch pattern in which the tops of the first pattern and of the second pattern touch by making the first pattern and the second pattern bend in directions in which they face each other.