The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Feb. 21, 2014
Applicant:
Sensata Technologies, Inc., Attleboro, MA (US);
Inventors:
Richard A. Davis, Peoria, AZ (US);
Christopher Lopez, Phoenix, AZ (US);
Assignee:
SENSATA TECHNOLOGIES, INC., Attleboro, MA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 1/067 (2006.01); G01R 1/20 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2874 (2013.01); G01R 31/2817 (2013.01); G01R 1/20 (2013.01);
Abstract
Methods and apparatus for a package on package (POP) thermal forcing device. A thermal interposer includes a test probe guide and insulator top, a thermal conductor, the test probe guide and insulator top affixed to a top surface of the thermal conductor, a test probe, and a test probe guide and insulator bottom affixed to a bottom surface of the thermal conductor, the test probe guide and insulator bottom configured in a ring-like shape to enable the thermal conductor to pass through and make contact with a bottom of a package on package (PoP) integrated circuit (IC).