The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Dec. 20, 2013
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Leo Schwab, Roseville, MI (US);

Chih-Cheng Hsu, Bloomfield Township, MI (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 21/08 (2006.01); H01M 10/653 (2014.01); H01M 10/6567 (2014.01); F28F 3/12 (2006.01); F28F 13/00 (2006.01);
U.S. Cl.
CPC ...
F28F 21/08 (2013.01); F28F 3/12 (2013.01); F28F 13/00 (2013.01); H01M 10/504 (2013.01); H01M 10/5075 (2013.01); F28F 2013/006 (2013.01);
Abstract

Disclosed herein are a variety of embodiments of a thermal interface material that may be used in a variety of systems and methods to improve heat transfer. One embodiment consistent with the present disclosure includes a heat dissipation system that includes a heat source and a heat sink. A thermal interface material may be at least partially disposed between the heat source and the heat sink. The thermal interface material may include a plurality of strands of thermally conductive material woven into a pattern. The thermal interface material may be configured to conform to the contact surfaces of the heat source and the heat sink to thereby increase transference of heat between the heat source and the heat sink.


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