The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Jul. 10, 2012
Applicants:

Takahiro Niwa, Tokyo, JP;

Akinao Hiraoka, Tokyo, JP;

Yoshifumi Fujita, Tokyo, JP;

Keiji Tsukahara, Tokyo, JP;

Masatake Onodera, Tokyo, JP;

Daisuke Ando, Tokyo, JP;

Isami Abe, Tokyo, JP;

Inventors:

Takahiro Niwa, Tokyo, JP;

Akinao Hiraoka, Tokyo, JP;

Yoshifumi Fujita, Tokyo, JP;

Keiji Tsukahara, Tokyo, JP;

Masatake Onodera, Tokyo, JP;

Daisuke Ando, Tokyo, JP;

Isami Abe, Tokyo, JP;

Assignee:

NICHIAS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F16L 9/14 (2006.01); F16L 59/08 (2006.01); F16L 59/14 (2006.01); F01N 13/14 (2010.01); F16L 59/02 (2006.01); F01N 13/16 (2010.01);
U.S. Cl.
CPC ...
F16L 59/08 (2013.01); F01N 13/148 (2013.01); F16L 59/029 (2013.01); F16L 59/143 (2013.01); F01N 13/16 (2013.01); F01N 2260/02 (2013.01); F01N 2310/06 (2013.01); F01N 2470/00 (2013.01); F01N 2510/02 (2013.01); F01N 2510/08 (2013.01); F01N 2530/26 (2013.01);
Abstract

A novel pipe cover is disclosed that can suppress thermal deterioration in a member that is positioned opposite to the pipe, and can control the temperature inside the pipe within a given range, even when a high-temperature fluid circulates through the pipe. The pipe cover is used to cover the outer periphery of a pipe, and includes a base that is formed of a tubular heat insulator, and a surface member that covers the outer surface of the base, a heat radiation section and a heat radiation-suppressing section being provided on the outer surface of the surface member, and the emissivity of the heat radiation section at a wavelength of 2 to 15 μm being higher than the emissivity of the heat radiation-suppressing section at a wavelength of 2 to 15 μm.


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