The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
Jul. 10, 2014
Applicant:
Tokuyama Corporation, Shunan-shi, Yamaguchi, JP;
Inventors:
Masahiro Nakamura, Shunan, JP;
Ryuji Ishimoto, Shunan, JP;
Assignee:
TOKUYAMA CORPORATION, Yamaguchi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 13/00 (2006.01); C09K 3/14 (2006.01); B24B 37/00 (2012.01); H01L 21/321 (2006.01); C01B 33/18 (2006.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
C09K 3/1463 (2013.01); B24B 37/00 (2013.01); B24B 37/044 (2013.01); C01B 33/183 (2013.01); C09K 3/1409 (2013.01); H01L 21/3212 (2013.01); C01P 2006/10 (2013.01); C01P 2006/12 (2013.01);
Abstract
To reduce scratches during polishing while ensuring an appropriately high polishing rate, provided are a silica for CMP satisfying the following (A) to (C), an aqueous dispersion using a silica for CMP, and a method of producing a silica for CMP: (A) a BET specific surface area of 40 m/g or more and 180 m/g or less; (B) a particle density measured by a He-gas pycnometer method of 2.24 g/cmor more; and (C) a coefficient of variation in primary particle diameter calculated by TEM/image analysis of 0.40 or less.