The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Sep. 20, 2012
Applicant:

Kaneka Corporation, Osaka-shi, Osaka, JP;

Inventors:

Ayako Yano, Takasago, JP;

Atsushi Fukunaga, Pasadena, TX (US);

Atsushi Kawakami, Takasago, JP;

Akira Ogawa, Takasago, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 3/10 (2006.01); C08L 43/04 (2006.01); C08K 5/57 (2006.01); C08L 33/08 (2006.01); C08G 65/26 (2006.01); C08G 65/336 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
C09K 3/1006 (2013.01); C08G 65/2663 (2013.01); C08G 65/336 (2013.01); C08K 5/0016 (2013.01); C08K 5/57 (2013.01); C08L 33/08 (2013.01); C08L 43/04 (2013.01); C09K 3/10 (2013.01);
Abstract

The present invention provides a sealant composition that includes a reactive silyl group-containing organic polymer, and gives a cured product having a low modulus and not having wrinkles or cracks on the surface even though the sealant includes as a curing catalyst a tetravalent tin compound, which is presumed to reduce recovery. The sealant composition is a one-component curable sealant composition including: a linear organic polymer (A) having a number average molecular weight of 11,000 to 30,000, and having an ethanol-elimination reactive silyl group at a molecular terminal; a tetravalent tin compound (B); and a plasticizer (C).


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