The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Oct. 07, 2014
Applicant:

T.h.t. Presses, Inc., Dayton, OH (US);

Inventors:

Michael Thieman, Kettering, OH (US);

Richard J. Kamm, Plain City, OH (US);

Assignee:

T.H.T. Presses, Inc., Dayton, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22D 17/30 (2006.01); B22D 17/20 (2006.01); B22D 17/22 (2006.01); B22D 17/12 (2006.01); G11B 33/02 (2006.01); G11B 25/04 (2006.01);
U.S. Cl.
CPC ...
B22D 17/2023 (2013.01); B22D 17/12 (2013.01); B22D 17/20 (2013.01); B22D 17/203 (2013.01); B22D 17/22 (2013.01); B22D 17/2272 (2013.01); G11B 25/043 (2013.01); G11B 33/022 (2013.01);
Abstract

A hermetically sealed disc drive comprising at least one aluminum alloy housing component manufactured with a thermally directed die casting press subassembly is disclosed. In one embodiment, the thermally directed die casting press subassembly comprises a thermally directed funnel gate that is skewed to sample molten material from an off-center portion of the shot sleeve. Disc drive housing components can be manufactured by injecting an aluminum alloy slurry from the shot sleeve through the thermally directed funnel gate and the injection nozzle into the die cavity. The aluminum alloy slurry may be a thixotropic slurry comprising a uniform primary aluminum particle size in the range of approximately 50 to 80 microns. The primary aluminum particles of cast products produced according to the methodology of the present disclosure, with the aforementioned particle size distribution, are free of encapsulated eutectic at the micron scale.


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