The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Jun. 29, 2015
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Tomoaki Nakamura, Nagano, JP;

Jiro Tsuruno, Nagano, JP;

Kanechika Kiyose, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); A61B 8/00 (2006.01); H01L 41/053 (2006.01);
U.S. Cl.
CPC ...
B06B 1/0622 (2013.01); A61B 8/4488 (2013.01); A61B 8/4494 (2013.01); B06B 1/0629 (2013.01); H01L 41/053 (2013.01);
Abstract

An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements and a plate-shaped member. The substrate includes a partition wall section defining a plurality of openings arranged in an array pattern. A wall thickness of the partition wall section is smaller than a wall height of partition wall section. Each of the ultrasonic transducer elements is provided in each of the openings. The plate-shaped member is fixed on a surface of the substrate opposite to a surface of the substrate on which the ultrasonic transducer elements are provided. The plate-shaped member covers at least one of the openings in a plan view seen along a thickness direction of the substrate.


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