The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Jan. 17, 2012
Applicants:

Robert J. Greenberg, Los Angeles, CA (US);

Alfred E. Mann, Beverly Hills, CA (US);

Neil Talbot, La Crescenta, CA (US);

Jerry OK, Canyon Country, CA (US);

Gaillard R. Nolan, Oxford, MD (US);

Dau Min Zhou, Saugus, CA (US);

Inventors:

Robert J. Greenberg, Los Angeles, CA (US);

Alfred E. Mann, Beverly Hills, CA (US);

Neil Talbot, La Crescenta, CA (US);

Jerry Ok, Canyon Country, CA (US);

Gaillard R. Nolan, Oxford, MD (US);

Dau Min Zhou, Saugus, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); A61N 1/375 (2006.01); A61N 1/05 (2006.01); H05K 3/36 (2006.01); H05K 1/03 (2006.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
A61N 1/375 (2013.01); A61N 1/0543 (2013.01); H05K 3/361 (2013.01); H05K 3/4691 (2013.01); H05K 1/0306 (2013.01); H05K 3/321 (2013.01); H05K 3/328 (2013.01); H05K 3/4015 (2013.01); H05K 3/423 (2013.01); H05K 3/4652 (2013.01); H05K 2201/09127 (2013.01); H05K 2201/1028 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/10295 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/0733 (2013.01); H05K 2203/1446 (2013.01); Y10T 29/49155 (2015.01);
Abstract

The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.


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