The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2017

Filed:

Dec. 21, 2012
Applicant:

Vessix Vascular, Inc., Laguna Hills, CA (US);

Inventors:

Prabodh Mathur, Laguna Niguel, CA (US);

Rabih Nassif, Corona, CA (US);

Henry H. Lee, Mission Viejo, CA (US);

Andres Dandler, Newport Coast, CA (US);

Joseluis Espinosa, San Diego, CA (US);

Assignee:

Vessix Vascular, Inc., Laguna Hills, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/36 (2006.01); A61B 18/18 (2006.01); A61B 18/14 (2006.01); A61N 5/00 (2006.01); A61B 18/00 (2006.01); A61B 18/12 (2006.01);
U.S. Cl.
CPC ...
A61N 1/36117 (2013.01); A61B 18/1492 (2013.01); A61B 18/18 (2013.01); A61N 1/3606 (2013.01); A61N 5/00 (2013.01); A61B 2018/0016 (2013.01); A61B 2018/0022 (2013.01); A61B 2018/00404 (2013.01); A61B 2018/00434 (2013.01); A61B 2018/00511 (2013.01); A61B 2018/00654 (2013.01); A61B 2018/00678 (2013.01); A61B 2018/00767 (2013.01); A61B 2018/00791 (2013.01); A61B 2018/124 (2013.01);
Abstract

Medical devices and methods for making and using the same are disclosed. An example device may include an expandable balloon including an outer surface. At least one flexible circuit may be mounted on the outer surface of the expandable balloon. The at least one flexible circuit may include a first insulating layer, at least one heat sensing device positioned at least partially within the first insulating layer, a conductive layer above the first insulating layer, at least a portion of which is electrically coupled to the heat sensing device, a second insulating layer above the conductive layer, and at least one electrode associated with the conductive layer.


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