The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Nov. 09, 2012
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Eiichi Ide, Tokyo, JP;
Eiji Nishioka, Tokyo, JP;
Toshiaki Ishii, Tokyo, JP;
Junpei Kusukawa, Tokyo, JP;
Kinya Nakatsu, Tokyo, JP;
Nobutake Tsuyuno, Tokyo, JP;
Toshiya Satoh, Hitachinaka, JP;
Masahiko Asano, Hitachinaka, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
An insulation film that strongly adheres to a power semiconductor module having a resin sealer and a conductor plate and has high thermal conductivity is provided. An insulation layeris provided between a power semiconductor moduleand a heat dissipation portionB. The power semiconductor moduleincludes a resin sealer, which covers a circumferential side surface of a conductor plate, and a plurality of recessesD are provided in the resin sealer. The insulation layeris formed of a spray coated film, an insulation film, and a resin layer, and the spray coated filmis formed on the surface of the resin sealerincluding recessesD to form a seamless flat surface. The planar size of each of the recessesD is greater than the planar size of each flat portion, which forms the spray coated film