The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Dec. 04, 2013
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Koichi Fujimaru, Otsu, JP;
Toshihisa Nonaka, Otsu, JP;
Assignee:
Toray Industries, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/32 (2006.01); C09J 163/00 (2006.01); C09J 179/08 (2006.01); C09J 193/04 (2006.01); H01L 21/683 (2006.01); H05K 3/30 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/323 (2013.01); C09J 163/00 (2013.01); C09J 179/08 (2013.01); C09J 193/04 (2013.01); H01L 21/6836 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H05K 3/305 (2013.01); C09J 2479/083 (2013.01); H01L 24/13 (2013.01); H01L 24/27 (2013.01); H01L 24/94 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81907 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83132 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83907 (2013.01); H01L 2224/83948 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/94 (2013.01); H01L 2924/01008 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); H05K 3/3436 (2013.01); H05K 3/3489 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10977 (2013.01); Y02P 70/613 (2015.11);
Abstract
The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent storage stability and excellent connection reliability. A means for solving the problem is an adhesive agent comprising (a) a polyamide, (b) an epoxy compound and (c) an acid-modified rosin.