The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

May. 29, 2014
Applicant:

Fujikura Ltd., Tokyo, JP;

Inventors:

Kazuhisa Itoi, Sakura, JP;

Masahiro Okamoto, Sakura, JP;

Assignee:

FUJIKURA LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01); H01L 23/538 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/10 (2013.01); H01L 21/4857 (2013.01); H01L 23/367 (2013.01); H01L 23/3677 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H05K 1/0206 (2013.01); H05K 1/0207 (2013.01); H05K 1/186 (2013.01); H05K 3/4614 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/08237 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/11312 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11416 (2013.01); H01L 2224/11418 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13009 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/1336 (2013.01); H01L 2224/1339 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/13309 (2013.01); H01L 2224/13311 (2013.01); H01L 2224/13313 (2013.01); H01L 2224/13316 (2013.01); H01L 2224/13324 (2013.01); H01L 2224/13339 (2013.01); H01L 2224/13344 (2013.01); H01L 2224/13347 (2013.01); H01L 2224/13355 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/16503 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73201 (2013.01); H01L 2224/73251 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/80447 (2013.01); H01L 2224/80903 (2013.01); H01L 2224/8185 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81862 (2013.01); H01L 2224/81907 (2013.01); H01L 2224/8349 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/9221 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15153 (2013.01); H05K 3/0061 (2013.01); H05K 3/4602 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/10674 (2013.01); Y10T 29/49126 (2015.01);
Abstract

A component built-in board comprises stacked therein a plurality of printed wiring bases having a wiring pattern and a via formed on/in a resin base thereof, and comprises an electronic component built in thereto, wherein at least a portion of the plurality of printed wiring bases include a thermal wiring in the wiring pattern and include a thermal via in the via, at least one of the plurality of printed wiring bases has formed therein an opening where the electronic component is built, and has formed therein a heat-conducting layer and closely attached to a surface on an opposite side to an electrode formation surface of the electronic component built in to the opening, and the electronic component is fixed in the opening by an adhesive layer stacked on the heat-conducting layer, via a hole formed in a region facing onto the opening of the heat-conducting layer.


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