The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Feb. 24, 2015
Applicant:
Motorola Mobility Llc, Chicago, IL (US);
Inventors:
Michael J Lombardi, Lake Zurich, IL (US);
Joseph L Allore, Mundelein, IL (US);
Natalie J Stevens, Spring Grove, IL (US);
Assignee:
Motorola Mobility LLC, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H05K 7/04 (2006.01); H05K 3/00 (2006.01); H04M 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); H04M 1/0277 (2013.01); H05K 1/11 (2013.01); H05K 3/4015 (2013.01); H05K 2201/10734 (2013.01); H05K 2203/0338 (2013.01); H05K 2203/308 (2013.01);
Abstract
A device interconnection system uses an indexed carrier to locate an array of contacts on an array of solder pads on a printed circuit board. In an embodiment, the PCB is indexed to a device housing in the same manner that it is indexed to the carrier, allowing the array of contacts to match and protrude through an array of holes in the housing. In a further embodiment, the housing is substantially metallic, and the array of holes in the housing are located in an insulating plate formed in the housing.