The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Mar. 14, 2016
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Mitsunori Abe, Kawasaki, JP;
Kiyoyuki Hatanaka, Kawasaki, JP;
Nobuo Taketomi, Kodaira, JP;
Shigeo Iriguchi, Kawasaki, JP;
Ryo Kanai, Kawasaki, JP;
Naoki Nakamura, Hachioji, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H05K 1/0298 (2013.01); H05K 1/0366 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 3/0047 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0959 (2013.01);
Abstract
Disclosed substrate with embedded component includes: an insulating base member; a conductive pad formed on the insulating base member; a component connected to the conductive pad with a solder; and a resin covering the component, wherein a hole is provided in the insulating base member and the conductive pad, and the insulating base member is exposed on a side surface of the hole.