The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

Jan. 12, 2012
Applicants:

Tomoyuki Unno, Tokyo, JP;

Kazuyoshi Inami, Tokyo, JP;

Kosuke Yasooka, Tokyo, JP;

Inventors:

Tomoyuki Unno, Tokyo, JP;

Kazuyoshi Inami, Tokyo, JP;

Kosuke Yasooka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01P 5/02 (2006.01); H01P 5/08 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H01L 23/49822 (2013.01); H01L 23/66 (2013.01); H01P 5/028 (2013.01); H05K 1/0222 (2013.01); H05K 1/18 (2013.01); H01L 2223/6622 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/15311 (2013.01); H01P 5/085 (2013.01); H05K 1/0216 (2013.01); H05K 1/0231 (2013.01); H05K 2201/09818 (2013.01);
Abstract

In a multilayer substrate, a quasi-coaxial line is formed as a structure for transmitting a high-frequency signal generated by a mounted high-frequency device from an uppermost layer to a lowermost layer to externally output and for transmitting an externally input high-frequency signal from the lowermost layer to the high-frequency device. The quasi-coaxial line has: a central conductor being a vertical through hole via that connects between a metal pattern formed on an upper surface of the uppermost layer and a metal pattern formed on a lower surface of the lowermost layer; and outer conductors being a plurality of interlayer vias that are circularly arranged around the central conductor and connect between two or more layers. Whole or a part of the vertical through hole via is substituted by a capacitor structure formed of conductor pads facing each other without any via.


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