The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

Feb. 18, 2015
Applicant:

Semikron Elektronik Gmbh & Co., KG, Nürnberg, DE;

Inventors:

Matthias Spang, Stein, DE;

Eduard Faller, Fürth, DE;

Lars Reuβer, Fürth, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H02M 7/003 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01);
Abstract

A power semiconductor module comprising internal load and auxiliary connection devices embodied as wire bonding connections. A substrate has a plurality of load and auxiliary potential areas, wherein a power switch is arranged on a first load potential area, said power switch being embodied as a plurality of controllable power subswitches arranged in series. The power subswitches have a load bonding connection consisting of a plurality of load bonding wires to a second load potential area, wherein a first bonding base is arranged on the second load potential area and an adjacent second bonding base of the respective load bonding wire is arranged on a contact area of the power subswitch.


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