The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

Jun. 30, 2016
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Wei-Yuan Cheng, Hsinchu County, TW;

Chen-Chu Tsai, Taichung, TW;

Yuh-Zheng Lee, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 21/683 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/4985 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H05K 1/0281 (2013.01); H05K 1/115 (2013.01); H05K 3/007 (2013.01); H05K 3/4038 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H05K 3/0032 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/2009 (2013.01); H05K 2203/1178 (2013.01);
Abstract

According to embodiments of the disclosure, an electronic device package may include a wire layer and a rigid element. The wire layer includes a first surface and a second surface opposite to each other, and the second surface of the wire layer has at least one coarse structure. A portion of the second surface having the coarse structure has a greater roughness than another portion of the second surface. The rigid element is disposed on the first surface of the wire layer, wherein a stiffness of the rigid element is greater than a stiffness of the wire layer and a projection area of the coarse structure on the first surface of the wire layer overlaps an edge of the rigid element.


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