The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Dec. 12, 2012
Applicants:
Joon-sam Kim, Yongin, KR;
Jong-hwan Kim, Yongin, KR;
Sang Won Yeo, Yongin, KR;
Sang-urn Lim, Yongin, KR;
Suk-ho Choi, Yongin, KR;
Inventors:
Joon-Sam Kim, Yongin, KR;
Jong-Hwan Kim, Yongin, KR;
Sang Won Yeo, Yongin, KR;
Sang-Urn Lim, Yongin, KR;
Suk-Ho Choi, Yongin, KR;
Assignee:
SAMSUNG DISPLAY CO., LTD., Yongin, Gyunggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 13/04 (2006.01); G02F 1/1345 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); G02F 1/13454 (2013.01); H05K 3/32 (2013.01); H05K 13/04 (2013.01); H05K 3/323 (2013.01); H05K 3/3494 (2013.01); H05K 2203/0278 (2013.01); Y10T 29/41 (2015.01); Y10T 29/4913 (2015.01); Y10T 29/53178 (2015.01);
Abstract
A display device includes an upper substrate on a lower substrate, a driver integrated chip (IC) on the lower substrate, the driver IC and upper substrate contacting different parts of the lower substrate, a plurality of bumper units along edges of the driver IC, and a deformation preventing bumper unit between the bumper units, the deformation preventing bumper unit being configured to prevent the driver IC from being deformed.