The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

Sep. 16, 2013
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Masaaki Kanae, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/05 (2006.01); H03H 3/08 (2006.01); H03H 9/10 (2006.01); H03H 3/007 (2006.01); H03H 3/02 (2006.01);
U.S. Cl.
CPC ...
H03H 9/05 (2013.01); H03H 3/007 (2013.01); H03H 3/02 (2013.01); H03H 3/08 (2013.01); H03H 9/0542 (2013.01); H03H 9/1014 (2013.01); H03H 9/1057 (2013.01); H03H 9/1071 (2013.01); Y10T 29/42 (2015.01); Y10T 29/49128 (2015.01);
Abstract

A method for producing an electronic component module prevents a space from collapsing. The method includes a step of preparing an electronic component including an element substrate, a drive device formed on a principal surface of the element substrate, and a protection device covering the drive device so as to form a space around the drive device; a step of fixing the electronic component on a common substrate such that a principal surface of the common substrate and another principal surface of the element substrate face each other; a step of fixing a reinforcing plate on the protection device of the electronic component; and a step of forming a resin layer on the principal surface of the common substrate such that the electronic component is contained therein.


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