The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

Jul. 07, 2016
Applicant:

Brphotonics Produtos Optoeletronicos Ltda., Campinas, BR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 12/70 (2011.01); H01R 13/22 (2006.01);
U.S. Cl.
CPC ...
H01R 12/7076 (2013.01); H01R 12/7005 (2013.01); H01R 12/7017 (2013.01); H01R 13/22 (2013.01);
Abstract

An assembly that provides solderless electrical interconnection between two devices provided with electrical contact lands that are distributed in plane Land Grid Arrays (LGA's). One of the devices can be a package containing an electronic or opto-electronic device and the other device can be a PCB. The alignment of the lands of the LGA's is provided by guides that include a frame having vertical walls and centering pins inserted into metallized via-holes provided in the PCB, the dimensions of the frame allowing the sliding insertion and extraction of the package. Electrical connection between the lands of the two LGA's is provided by a contactor pad placed between the package and the PCB. The assembly includes a cover removably attached to the frame by a locking mechanism, the cover being provided with one or more elastic members which exert a downward force over the package compressing it against the contactor pad.


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