The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

Dec. 17, 2013
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Beijing Boe Display Technology Co., Ltd., Beijing, CN;

Inventors:

Huibin Guo, Beijing, CN;

Shoukun Wang, Beijing, CN;

Xiaowei Liu, Beijing, CN;

Xiaming Zhu, Beijing, CN;

Zongjie Guo, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H01M 4/02 (2006.01); H01M 4/04 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); G02F 1/1362 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); H05K 1/11 (2006.01); G02B 27/22 (2006.01); H05K 1/03 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H01M 4/02 (2013.01); H01M 4/0404 (2013.01); H05K 1/0284 (2013.01); H05K 1/0296 (2013.01); H05K 1/09 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); G02B 27/2214 (2013.01); G02F 1/136286 (2013.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 3/064 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0326 (2013.01); H05K 2201/10136 (2013.01);
Abstract

An embodiment of the present invention discloses a 3D barrier substrate and a method for manufacturing the same, and a display device in order to improve the utilization of facilities, increase the production efficiency, and decrease the cost of production. The method of manufacturing 3D barrier substrate comprises: forming a transparent electrode thin film on a substrate, and forming a passivation layer on the transparent electrode thin film; forming an transparent electrode and a passivation layer via hole by a patterning process, wherein the via hole is used for coupling the transparent electrode to the signal line; and forming a signal line, wherein the signal line is coupled to the transparent electrode through the via hole.


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