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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9590156 B1

PDFFull Text
Date of Patent:
Mar. 07, 2017

Filed:

Feb. 10, 2015

Light-emitting device package and method of manufacturing thereof

Applicant:

Lightizer Korea Co., Seoul, KR;

Inventors:

Jae Sik Min, Anyang, KR;

Jae Young Jang, Anyang, KR;

Jae Yeop Lee, Anyang, KR;

Byoung Gu Cho, Anyang, KR;

Assignee:

LIGHTIZER KOREA CO., Seoul, KR;

Attorneys:

Madeline F. Schiesser

Keohane & D'Alessandro PLLC

Primary Examiner:

David Nhu

Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 33/62 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/505 (2013.01); H01L 33/508 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The present invention provides a light-emitting diode (LED) package including: a substrate on which a set of bonding pads are formed; an LED element configured to provide light of a predetermined wavelength region, having a set of chip pads formed on a top surface thereof and being attached on a top surface of the substrate; a set of gold wires connecting the bonding pads of the substrate with the chip pads of the LED element; a phosphor layer formed in a cap shape having side and top portions of a uniform thickness and being configured to surround sides and a top surface of the LED element while being spaced apart therefrom; and a filler disposed to fill a space formed between the phosphor layer and the LED element, wherein the LED element, the gold wires, and the bonding pads of the substrate are under the phosphor layer cap.

Find Patent Forward Citations

Min, Jae. (2017). Light-emitting device package and method of manufacturing thereof (U.S. Patent No. 9590156). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9590156

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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