The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Mar. 14, 2013
Applicant:
Cree, Inc., Durham, NC (US);
Inventors:
Christopher P. Hussell, Cary, NC (US);
Jesse Colin Reiherzer, Wake Forest, NC (US);
Erin Welch, Chapel Hill, NC (US);
Assignee:
Cree, Inc., Durham, NC (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/60 (2010.01); H05K 3/24 (2006.01); H01L 25/075 (2006.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/60 (2013.01); H05K 3/244 (2013.01); H01L 25/0753 (2013.01); H01L 33/641 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2933/0033 (2013.01); H05K 2201/0341 (2013.01); H05K 2201/099 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01); H05K 2203/073 (2013.01); H05K 2203/1461 (2013.01);
Abstract
Light emitting devices and substrates are provided with improved plating. In one embodiment, a light emitting device can include a submount and one or more light emitting diodes (LED) chips disposed over the submount. In one embodiment, the submount can include a copper (Cu) substrate, a first metallic layer of material that is highly reflective disposed over the Cu substrate for increased brightness of the device, and a second metallic layer disposed between the Cu substrate and the first metallic layer for forming a barrier therebetween.