The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9590130 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 07, 2017

Filed:

Apr. 30, 2012
Applicants:

Anthony Lochtefeld, Ipswich, MA (US);

Chris Leitz, Watertown, MA (US);

Mark Carroll, Tewksbury, MA (US);

Inventors:

Anthony Lochtefeld, Ipswich, MA (US);

Chris Leitz, Watertown, MA (US);

Mark Carroll, Tewksbury, MA (US);

Assignee:

AMBERWAVE INC., Salem, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/044 (2014.01); H01L 31/18 (2006.01); H01L 31/0687 (2012.01);
U.S. Cl.
CPC ...
H01L 31/1804 (2013.01); H01L 31/06875 (2013.01); H01L 31/184 (2013.01); H01L 31/1896 (2013.01); Y02E 10/544 (2013.01); Y02E 10/547 (2013.01); Y02P 70/521 (2015.11);
Abstract

A device, system, and method for solar cell construction and bonding/layer transfer are disclosed herein. An exemplary structure of solar cell construction involves providing a monocrystalline donor layer. A solder bonding layer bonds the donor layer to a carrier substrate. A porous layer may be used to separate the donor layer.


Find Patent Forward Citations

Lochtefeld, Anthony. (2017). Thin film solder bond (U.S. Patent No. 9590130). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9590130

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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