The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Dec. 10, 2014
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Jihwan Hwang, Asan-si, KR;
Young Kun Jee, Suwon-si, KR;
Jung-Hwan Kim, Bucheon-si, KR;
Tae Hong Min, Gumi-si, KR;
Kwang-chul Choi, Suwon-si, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/18 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/56 (2013.01); H01L 21/563 (2013.01); H01L 21/6835 (2013.01); H01L 23/3185 (2013.01); H01L 24/97 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06582 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01);
Abstract
Provided are semiconductor devices and methods of manufacturing the same. The semiconductor package includes a substrate, a first semiconductor chip mounted on the circuit substrate and having a first width, a second semiconductor chip overlying the first semiconductor chip and having a second width greater than the first width, and a first under filler disposed between the first and second semiconductor chips, covering a side surface of the first semiconductor chip and having an inclined side surface.