The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Jul. 21, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 23/367 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 23/36 (2006.01); H01L 23/427 (2006.01); H01L 23/532 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/36 (2013.01); H01L 23/481 (2013.01); H01L 25/0652 (2013.01); H01L 23/3128 (2013.01); H01L 23/427 (2013.01); H01L 23/53223 (2013.01); H01L 23/53233 (2013.01); H01L 23/53238 (2013.01); H01L 23/53252 (2013.01); H01L 23/53266 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16195 (2013.01);
Abstract
A semiconductor package includes a package base substrate, at least one first semiconductor chip disposed on the package base substrate, and at least one stacked semiconductor chip structure disposed on the package base substrate adjacent to the at least one first semiconductor chip. The at least one stacked semiconductor chip includes a plurality of second semiconductor chips. A penetrating electrode region including a plurality of penetrating electrodes is disposed adjacent to an edge of the at least one stacked semiconductor chip structure.