The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Jul. 15, 2015
Applicant:
Hyundai Motor Company, Seoul, KR;
Inventors:
Kyoung-Kook Hong, Hwaseong-si, KR;
Hyun Woo Noh, Seoul, KR;
Youngkyun Jung, Seoul, KR;
Dae Hwan Chun, Gwangmyeong-si, KR;
Jong Seok Lee, Suwon-si, KR;
Su Bin Kang, Busan, KR;
Assignee:
HYUNDAI MOTOR COMPANY, Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 1/19 (2006.01); H01L 23/00 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); B23K 20/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B23K 20/02 (2013.01); B23K 35/025 (2013.01); B23K 35/3006 (2013.01); H01L 24/27 (2013.01); B23K 2203/08 (2013.01); B23K 2203/18 (2013.01); B23K 2203/52 (2015.10); B23K 2203/56 (2015.10); H01L 2224/2741 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/832 (2013.01); H01L 2224/83825 (2013.01);
Abstract
Disclosed is a method for bonding with a silver paste, the method including: coating a silver paste on a semiconductor device or a substrate, the silver paste containing silver and indium; disposing the semiconductor on the substrate; and heating the silver paste to form a bonding layer, wherein the semiconductor device and the substrate are bonded to each other through the bonding layer, and wherein the indium is contained in the silver paste at 40 mole % or less.