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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9589925 B1

PDFFull Text
Date of Patent:
Mar. 07, 2017

Filed:

Jul. 15, 2015

Method for bonding with a silver paste

Applicant:

Hyundai Motor Company, Seoul, KR;

Inventors:

Kyoung-Kook Hong, Hwaseong-si, KR;

Hyun Woo Noh, Seoul, KR;

Youngkyun Jung, Seoul, KR;

Dae Hwan Chun, Gwangmyeong-si, KR;

Jong Seok Lee, Suwon-si, KR;

Su Bin Kang, Busan, KR;

Assignee:

HYUNDAI MOTOR COMPANY, Seoul, KR;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Erin Saad

Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 1/19 (2006.01); H01L 23/00 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); B23K 20/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B23K 20/02 (2013.01); B23K 35/025 (2013.01); B23K 35/3006 (2013.01); H01L 24/27 (2013.01); B23K 2203/08 (2013.01); B23K 2203/18 (2013.01); B23K 2203/52 (2015.10); B23K 2203/56 (2015.10); H01L 2224/2741 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/832 (2013.01); H01L 2224/83825 (2013.01);
Abstract

Disclosed is a method for bonding with a silver paste, the method including: coating a silver paste on a semiconductor device or a substrate, the silver paste containing silver and indium; disposing the semiconductor on the substrate; and heating the silver paste to form a bonding layer, wherein the semiconductor device and the substrate are bonded to each other through the bonding layer, and wherein the indium is contained in the silver paste at 40 mole % or less.

Find Patent Forward Citations

Hong, Kyoung-Kook. (2017). Method for bonding with a silver paste (U.S. Patent No. 9589925). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9589925

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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