The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Aug. 26, 2015
Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd., Zhuhai, CN;
Dror Hurwitz, Zhuhai, CN;
Alex Huang, Zhuhai, CN;
Abstract
An embedded die package and method of manufacture, the die package comprising a die having I/O contact pads in a passivation layer wherein the die contact pads are coupled to a first side of a feature layer by an adhesion/barrier layer, and a layer of pillars extends from a second side of the feature layer, the die, feature layer and the layer of pillars being encapsulated by a dielectric material and wherein the feature layer comprises routing lines that are individually drawn by laser exposure of photoresist under guidance of an optical imaging system for good alignment with both the I/O contact pads of the die and with the subsequently to be deposited pillars that are positioned with respect to the package edges.