The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2017

Filed:

Nov. 28, 2014
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Herbert Gietler, Villach, AT;

Robert Pressl, Klagenfurt, AT;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 29/06 (2006.01); G01R 31/26 (2014.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/58 (2013.01); G01R 31/2601 (2013.01); H01L 22/34 (2013.01); H01L 29/0649 (2013.01); H01L 29/0684 (2013.01); H01L 2924/0002 (2013.01);
Abstract

According to various embodiments, a semiconductor chip may include: a semiconductor body region including a first surface and a second surface opposite the first surface; a capacitive structure for detecting crack propagation into the semiconductor body region; wherein the capacitive structure may include a first electrode region at least partially surrounding the semiconductor body region and at least substantially extending from the first surface to the second surface; wherein the capacitive structure further may include a second electrode region disposed next to the first electrode region and an electrically insulating region extending between the first electrode region and the second electrode region.


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