The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Apr. 15, 2015
International Business Machines Corporation, Armonk, NY (US);
Gregory Bazan, Essex Junction, VT (US);
Thomas F. Houghton, Marlboro, NY (US);
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Abstract
The present invention relates generally to semiconductor devices and more particularly, to a structure and method of creating a non-permeable edge seal around a whole wafer. The edge seal may be located between an inner region of a wafer comprising product chips and an outer edge of the wafer. The edge seal may comprise a fillet region adjacent the inner region, and a dielectric extension adjacent the fillet region. The dielectric extension region may be impermeable to moisture and composed of a dielectric layer on the wafer and a capping layer on the dielectric layer. The fillet region may comprise a lower metal fillet directly on the wafer, a dielectric layer on the lower metal fillet, an upper metal fillet on the dielectric layer, and a capping layer on the upper metal fillet. The fillet region may be adjacent to and in contact with a permeable layer formed on the product region.