logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9589877 B1

PDFFull Text
Date of Patent:
Mar. 07, 2017

Filed:

Jan. 08, 2014

Semiconductor device and method for manufacturing the same

Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Shigefumi Dohi, Shiga, JP;

Kiyomi Hagihara, Osaka, JP;

Assignee:

Panasonic Corporation, Osaka, JP;

Attorneys:

Panasonic IP Management

Kerry S. Culpepper

Primary Examiner:

Zandra Smith

Assistant Examiner:

John M Parker

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/498 (2006.01); H01L 25/18 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/03 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/563 (2013.01); H01L 23/49816 (2013.01); H01L 23/5389 (2013.01); H01L 24/81 (2013.01); H01L 25/03 (2013.01); H01L 25/18 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06527 (2013.01);
Abstract

A semiconductor device includes an expanded semiconductor chip having a first semiconductor chip and an expanded portion extending outward from a side surface of the first semiconductor chip, a second semiconductor chip provided so as to be connected to the expanded semiconductor chip via a plurality of first bumps, and a base provided so as to be connected to the expanded semiconductor chip via a plurality of second bumps. The first bumps are provided between the first semiconductor chip and the second semiconductor chip. The second bumps are provided between the expanded portion and the base.

Find Patent Forward Citations

Quick Actions:

Dohi, Shigefumi. (2017). Semiconductor device and method for manufacturing the same (U.S. Patent No. 9589877). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9589877

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…