The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Sep. 17, 2015
Applicants:
Stmicroelectronics (Crolles 2) Sas, Crolles, FR;
Socpra Sciences ET Génie S.e.c., Sherbrooke, CA;
Inventors:
Assignees:
STMicroelectronics (Crolles 2) SAS, Crolles, FR;
SOCPRA Sciences et Génie S.E.C., Sherbrooke, CA;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 21/311 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 21/54 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/42 (2006.01); H01L 23/492 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/31116 (2013.01); H01L 21/4825 (2013.01); H01L 21/4853 (2013.01); H01L 21/4875 (2013.01); H01L 21/4878 (2013.01); H01L 21/52 (2013.01); H01L 21/54 (2013.01); H01L 21/563 (2013.01); H01L 23/3121 (2013.01); H01L 23/3157 (2013.01); H01L 23/42 (2013.01); H01L 23/473 (2013.01); H01L 23/492 (2013.01); H01L 23/4952 (2013.01); H01L 24/27 (2013.01); H01L 24/33 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 23/315 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/351 (2013.01); H01L 2924/37002 (2013.01);
Abstract
An assembly is made of an integrated circuit chip and a plate. At least one channel is arranged between the chip and the plate. The channel is delimited by metal sidewalls at least partially extending from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.