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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9589874 B1

PDFFull Text
Date of Patent:
Mar. 07, 2017

Filed:

Sep. 17, 2015

Assembly of an integrated circuit chip and of a plate

Applicants:

Stmicroelectronics (Crolles 2) Sas, Crolles, FR;

Socpra Sciences ET Génie S.e.c., Sherbrooke, CA;

Inventors:

Louis-Michel Collin, Quebec, CA;

Luc Guy Frechette, Sherbrooke, CA;

Sandrine Lhostis, Theys, FR;

Assignees:

STMicroelectronics (Crolles 2) SAS, Crolles, FR;

SOCPRA Sciences et Génie S.E.C., Sherbrooke, CA;

Attorney:

Gardere Wynne Sewell LLP

Primary Examiner:

Nitin Parekh

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 21/311 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 21/54 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/42 (2006.01); H01L 23/492 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/31116 (2013.01); H01L 21/4825 (2013.01); H01L 21/4853 (2013.01); H01L 21/4875 (2013.01); H01L 21/4878 (2013.01); H01L 21/52 (2013.01); H01L 21/54 (2013.01); H01L 21/563 (2013.01); H01L 23/3121 (2013.01); H01L 23/3157 (2013.01); H01L 23/42 (2013.01); H01L 23/473 (2013.01); H01L 23/492 (2013.01); H01L 23/4952 (2013.01); H01L 24/27 (2013.01); H01L 24/33 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 23/315 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/351 (2013.01); H01L 2924/37002 (2013.01);
Abstract

An assembly is made of an integrated circuit chip and a plate. At least one channel is arranged between the chip and the plate. The channel is delimited by metal sidewalls at least partially extending from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.

Find Patent Forward Citations

Collin, Louis-Michel. (2017). Assembly of an integrated circuit chip and of a plate (U.S. Patent No. 9589874). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9589874

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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