The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Jan. 28, 2016
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;
Kunihito Kato, Nisshin, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, JP;
Abstract
A method for manufacturing a semiconductor device is provided. The method includes a process of applying liquid to one surface of a support substrate; a process of warping the support substrate by a volume change due to a phase transition of the liquid by solidifying the liquid; a process of attaching a semiconductor substrate having a linear expansion coefficient different from that of the support substrate to the support substrate in a heated state; and a process of warping the support substrate due to a linear expansion coefficient difference between the semiconductor substrate and the support substrate by cooling the support substrate to which the semiconductor substrate is attached. A warping direction due to the phase transition is opposite to a warping direction due to the linear expansion coefficient difference.