The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Jul. 16, 2014
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Che-heung Kim, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor device package may include: a semiconductor chip element; and a supporting structure on which the semiconductor chip element is mounted and including an electrical connection element for connecting the semiconductor chip element to an external terminal. The supporting structure may include: a first lead frame including a heat dissipation element; a second lead frame coupled to the first lead frame; and/or an insulator configured to electrically insulate the first and second lead frames from each other. Each of the first and second lead frames may include a mounting region on which the semiconductor chip element is mounted. The first lead frame may include: a first portion; and/or a second portion formed on the first portion and having a smaller width than that of the first portion. The insulator may be on the first portion around the second portion. The second lead frame may be on the insulator.