The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Apr. 22, 2014
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventor:
Min Sung Choi, Suwon-Si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01F 41/04 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 27/29 (2006.01);
U.S. Cl.
CPC ...
H01F 41/046 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/292 (2013.01); Y10T 29/49078 (2015.01);
Abstract
A chip electronic component may include an insulating layer formed on a lower portion of a side surface of an internal coil pattern to avoid a direct contact between the internal coil pattern and a magnetic material, thereby preventing a waveform distortion indicating a reduction in inductance at high frequency.