The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2017
Filed:
Nov. 02, 2012
Hyun Hee Namkung, Uiwang-si, KR;
Jae Sun Han, Uiwang-si, KR;
Hyun Wook Kim, Uiwang-si, KR;
Jin Young Seo, Uiwang-si, KR;
Kwang Jin Jung, Uiwang-si, KR;
Dong Seon Uh, Uiwang-si, KR;
Hyun Hee Namkung, Uiwang-si, KR;
Jae Sun Han, Uiwang-si, KR;
Hyun Wook Kim, Uiwang-si, KR;
Jin Young Seo, Uiwang-si, KR;
Kwang Jin Jung, Uiwang-si, KR;
Dong Seon Uh, Uiwang-si, KR;
CHEIL INDUSTRIES, INC., Gumi-Si, Kyeongsangbuk-Do, KR;
Abstract
A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less.